Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference

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Product Details
Customization: Available
Application: Construction, Woodworking
Bonding Function: High Temperature Resistant Adhesive
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  • Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference
  • Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference
  • Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference
  • Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference
  • Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference
  • Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference
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  • Overview
  • Product Description
  • Applications
Overview

Basic Info.

Model NO.
GR0016
Color
Yellow
Composition
Organic Material
Morphology
Solvent
Components
Single Component
Viscosity
600-1300
Appearance/Color
Transparent to Slightly Yellow, Amber Liquid
Solid Content
21-24%
Flash Point
3°C (Abel Pensky)
Density
0.94~0.98 (26) g/cm3
Recommended Dry Film Thickness
15-20um
Typical Coating Area
12-15 M²/L (15-20um)
Transport Package
Support Customized
Trademark
Guangri
Origin
China
HS Code
39100000
Production Capacity
180000 Metric Ton/Metric Tons Per Year

Packaging & Delivery

Package Size
100.00cm * 40.00cm * 30.00cm
Package Gross Weight
50.000kg

Product Description

Product Description

This product is epoxy resin adhesive, suitable for stone dry hanging, strong bonding, engineering grouting and repairing joints, planting tendons and stone tile Mosaic and modeling; Can be used for water pipe, water tank, swimming pool, repair the seam of ships, instead of thick white paint to do water pipe connection seal, Temporary plugging of containers or pipes that cannot be welded by the chemical plant.In the metal and metal, metal and stone or ceramic tile, stone and stone, ceramic tile and ceramic tile, metal and concrete, metal and glass can be well bonded (users need to confirm according to their own requirements after the experiment).

• Solvent free, will not pollute the stone and the ceramic tile, for indoor and outdoor use.
Long storage time, no layering, no caking, easy to stir during construction, no flow.
Not afraid of moisture, can be all-weather construction,
• Resistance to oil and bad weather, but must avoid strong acid strong alkali and strong solvent for a long time immersion

Applications

Application for Wood:
Specification:

  GR-EP-2422
EP-2422A
Appearance Colorless to light yellow transparent liquid
Viscosity cp/25ºC 4000-6000
Density g/cm3 1.10-1.20
Mixing mass ratio 2422A/2422B=4/1
Mixing viscosity cp/25ºC 500-1500
Thin layer surface drying time h/25ºC 4-6
Recommended curing conditions Room temperature 8h + 60ºC 6h or room temperature 28h
Features:
1. Low mixing viscosity and good processability.
2. The curing temperature range is adjustable and can be cured at room temperature or quickly cured by heating.
3. Suitable for hand lay-up, bonding and other processes.

Storage:

1. Store in a sealed container in a cool, dry place indoors. Close the container tightly after use to prevent moisture absorption.
2. This product has a shelf life of 12 months when stored in a sealed container. If the expiration date has expired, it can still be used after passing testing.

Application for Metal:
Specification:

Product Type adhesive
Components Single component
Viscosity 600-1300 (CPS@25ºCBrookfield Viscometer, Spindle 3 at 60 rpm); 20-24 seconds (Zahn Cup 3 at 26°C)
Appearance/color Transparent to slightly yellow, amber liquid
Solid content 21-24%
Flash point 3°C (Abel Pensky)
Density 0.94~0.98 (26) g/cm3
Recommended dry film thickness 15-20um((The film thickness varies slightly depending on the application)
Typical coating area 12-15 m²/L (15-20um)
Elastomer:
1. Cast polyurethane
(CPU)
2. Mixable
 polyurethane(MPU)
3.
Injection molded parts

Features and Benefits:
1. Excellent bonding performance, in addition to metals, it can also bond epoxy and glass fiber reinforced plastics

2. Single coating, no need to consider primer

Shelf Life/Storage Conditions:
1. The shelf life is 24 months from the date of production, provided the product is in its original, unopened container and stored at 5-35°C.

2. Store in a cool, dry place and avoid direct sunlight, sparks, open flames, or heat sources.

Typical Packing:
4L/barrel, 18L/barrel, special requirements can be arranged for subcontracting, and 200ml, 500ml sample packaging is also available.


Application for Stone:
Specification:
Testing items Testing index
Appearance Smooth and evenly paste, no segregation, particles or gel, A component is pure white paste; B is light yellow paste
Working time(min) 40-60
Press shear strength stone - stone ≥10.0
Press shear strength stone - stainless steel (MPa ) ≥10.0
Directions:
Surface treatment: no floating pulp, loose material, dust, oil and grease;
P
reparation: thoroughly mix component A and component B according to the weight ratio of the operation instructions until presenting uniform color;
Spary: use a rigid scraper or similar tool to apply the mixed glue paste on the surface of the adhesive for bonding.


Package:
2.0kg/set,6 sets/ box;10 kg/set;20 kg/set

Storage and Transportation:

Keep in dark and cool place, valid for 12 months;

Non-dangerous goods, can be transported by car, train, ship, etc.
Hot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic InterferenceHot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic InterferenceHot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic InterferenceHot Melt Adhesive Glue Resin Epoxy Potting Adhesive for The Overall Encapsulation of Base Station Modules to Shield Against Partial Electromagnetic Interference

 

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